Reliability

Substrates and modules based on ALOXTM have passed various industry standard reliability tests and demonstrated high reliability of substrates & technology.

Thermal Cycling of Substrates -55C/+125C,no bias, 1000vias,0.5 mm pitch ESDC 22-A104-B >1000 Cycles Thermal Cycling of Assembly (dies assembled on substrate) -55C/+125C, 10min dwell time; Mil Std. 1010 >1000 Cycles HAST Molded unit / Change in efficiency A110-B PASS (<5%) Mechanical Vibration ~ 2000 Hz, 16min, 15g IPC-TM-650; Method 2.6.9 PASS

ALOX substrate compared with PCB as an interposer for high power density module. Results demonstrate clear superiority of ALOX in thermal performance.